Ultra-fast 3D Lithography equipment for sustainable production for substrate formats up to 4" (6” in customized equipment).
World’s first modularly built lithography system which satisfies academic needs and industrial requirements. LithoProf3D®-GSII supports component fabrication as well as master fabrication (creation of masters for nano- and micro-replication for series manufacturing).
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- Ultra-fast 3D Lithography equipment for sustainable production for substrate formats up to 4".
- Fits in any standard production line.
- Prints on substrates of any shape or kind with a large build volume, enabling on-device printing.
- Exclusive 5-axes design for position-synchronized movements that enable stitching-free processing.
- Tunable dimensionality of structures from 1D via 2D and 2.5D to real 3D structure fabrication.
- Ultra-fast fabrication with tunable resolution down to sub-µm.
- Works with all photoresists, photostructurable glasses.
- Thin-film metal ablation included: just change the process parameters.
- Virtual Machine Code Creator with numerous implemented and combinable fabrication strategies.
- MPO’s software controls the fabrication parameters to adjust resolution throughout the process. It allows to print critical parts in high-resolution, and to gain speed in other parts.
- Touch screen with user-friendly GUI and remote control.
- LithoBath3D: Easy to exchange exposure configuration for large-scale structures. Not limited by the working distance of the objective (no manual adjustment required) with automatic switching of laser path (patent exclusively licensed).
- LithoDILL3D: Exposure mode for objective in physical contact with the photoresist (dip-in 3D lithography) with constant optical conditions throughout the printing (patent exclusively licensed).
- Chuck: Base with exchangeable plates for different substrate formats and shapes (wafers, glass substrates, …).
- Vision-to-Align System: Enables automated detection of the target printing positions on the workpiece (position, orientation).
What is the central laser wavelength used in Multiphoton Optics' equipments?
Multiphoton Optics uses fs-pulsed lasers operating in the green spectral range. State-of-the art in TPP technology are either green or NIR lasers. Green lasers are especially suited to process ORMOCER®s, a unique and well-established material class.
Stitching vs. non-stitching
Multiphoton Optics systems can work on a stitching as well as a non-stitching exposure strategy.
Typically, Multiphoton Optics systems consist of a galvo-scanner to deflect the laser beam and a translation stage to move the sample. The galvo-scanner exhibits very high dynamics and enables high scanning speeds. However, the working area is limited to the Field-of-View (FoV) of the microscope objective. To realize structures that are larger than the FoV a step-and-expose method is applied which can result in positioning as well as stitching errors.
To avoid stitching the structuring can be executed by using the translation stage only. However, as the translation stage exhibits inertia, the available scan speed is limited.
To benefit from both the high dynamics of the galvo-scanner as well as the process area of the translation stage, Multiphoton Optics systems are equipped with a so-called Infinite Field-of-View (IFoV) mode which is based on the synchronized movement of the galvo-scanner and the translation stage.
What kind of stitching algorithms are available?
When stitching is applied sophisticated algorithms and strategies have to be used to minimize or even completely prevent potential artefacts. Multiphoton Optics has implemented intelligent methods based on stitching via galvo-scanner only and on synchronized IFoV.
What surface roughness do you achieve?
Depending on the requirements the surface roughness (RMS) can be adjusted to lower than 10 nm. It is to mention that the target roughness will influence the fabrication time.
What kind of photoresist can be structured?
- Negative photoresists: exposed areas are cross-linked and remain on the substrate.
- Positive photoresists: exposed areas are removed by the development step.
What kind of substrates can be used?
The TPP technology enables fabrication on regular planar substrates (e.g. glass or silicon wafers) as well as direct fabrication on active/passive devices (e.g. lasers, photodiodes, fibers).
What are typical substrate thicknesses?
Using air immersion objectives or dip-in objectives the substrate thickness can be as high as several centimeters. Using oil-immersion objectives, typical thickness is 0.17 mm. Processing on ultra-thin subtrates with a thickness of only 30 micrometer is also possible.
What type of focussing optics can be used?
Multiphoton Optics uses immersion and air objectives. Immersion objectives exhibit high numerical apertures to ensure highest printing resolution. Immersion objectives can either be used as oil immersion type or as dip-in type with the objective in physical contact with the photoresist. Air objectives exhibit lower numerical apertures but in general provide a larger Field-of-View (FoV).
What are typical scan speeds used in fabrication?
Typical maximum scan speeds are in the range of 50 – 200 mm/s.
As TPP is based on raster or vector scanning, fabrication with constant scan speed is required. This requires acceleration of the laser beam. Due to the underlying acceleration dynamics the optimum scan speed depends on the distance between two points. The larger/smaller the distance the higher/lower the optimum scan speed.
What is full-volume scan and contouring scan?
A full-volume scan exposes the complete volume of a structure in a layer-by-layer process. This method in appropriate for complex 3D structures.
A contouring scan exposes only the shell of a structure. The inner part can be polymerized after the development step by a simple UV exposure. This method is appropriate especially for lenses.
What is 2D/3D contouring?
The contouring method can be applied with two different strategies. The 2D contouring exposes the shell of a structure in a layer-by-layer manner. The 3D contouring scans the real topography of a structure. For both 2D/3D contouring the enclosed unpolymerized photoresist will be cross-linked in a subsequent UV exposure after the development step.
What are the advantages of ORMOCER®s?
The material class of ORMOCER®s exhibit unique chemical, physical and mechanical properties. ORMOCER®s consist of an inorganic-organic network. The inorganic components provide glass-like properties whereas the organic components enable conventional processing as pure organic polymers. One of the mainly used ORMOCER® in TPP is the well-known OrmoComp®.
UV-curable Hybrid Polymers For Micro and Nano Optical Components - Unique Features:
- Excellent transparency for VIS and near UV down to 350 nm.
- Excellent thermal stability of cured patterns up to 300 °C (short term), 270 °C (long term).
- High mechanical and chemical stability of cured patterns.
- High resolution down to 100 nm feature size.
- Compatible to UV imprint and UV moulding.
- Compatible to UV lithography with proximity exposure.
- Ready-to-use solutions, solvent-free formulations.
- Well-established in industrial large-volume production of optical components.
- Very fast UV curing.
- Very high climate stability.
- Compatible to various stamp materials (e.g. PDMS, PFPE, OrmoStamp®, quartz, Ni).